Atom chips on direct bonded copper substrates

Matthew B. Squires; James A. Stickney; Evan J. Carlson; Paul M. Baker; Walter R. Buchwald; Sandra Wentzell; Steven M. Miller

doi:10.1063/1.3529434

Atom chips on direct bonded copper substrates

Matthew B. Squires
, James A. Stickney
, Evan J. Carlson
, Paul M. Baker
, Walter R. Buchwald
, Sandra Wentzell
, Steven M. Miller

Engineering

Air Force Research Laboratory

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	023101
Journal	Review of Scientific Instruments
Volume	82
Issue number	2
DOIs	https://doi.org/10.1063/1.3529434
State	Published - Feb 2011

ASJC Scopus Subject Areas

Instrumentation

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10.1063/1.3529434

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title = "Atom chips on direct bonded copper substrates",

author = "Squires, \{Matthew B.\} and Stickney, \{James A.\} and Carlson, \{Evan J.\} and Baker, \{Paul M.\} and Buchwald, \{Walter R.\} and Sandra Wentzell and Miller, \{Steven M.\}",

year = "2011",

month = feb,

doi = "10.1063/1.3529434",

language = "English",

volume = "82",

journal = "Review of Scientific Instruments",

issn = "0034-6748",

publisher = "American Institute of Physics",

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AU - Squires, Matthew B.

AU - Stickney, James A.

AU - Carlson, Evan J.

AU - Baker, Paul M.

AU - Buchwald, Walter R.

AU - Wentzell, Sandra

AU - Miller, Steven M.

PY - 2011/2

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DO - 10.1063/1.3529434

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VL - 82

JO - Review of Scientific Instruments

JF - Review of Scientific Instruments

IS - 2

M1 - 023101

ER -

Atom chips on direct bonded copper substrates

ASJC Scopus Subject Areas

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