TY - GEN
T1 - Integration of IR focal plane arrays with massively parallel processor
AU - Esfandiari, P.
AU - Koskey, P.
AU - Vaccaro, K.
AU - Buchwald, W.
AU - Clark, F.
AU - Krejca, B.
AU - Rekeczky, C.
AU - Zarandy, A.
PY - 2008
Y1 - 2008
N2 - The intent of this investigation is to replace the low fill factor visible sensor of a Cellular Neural Network (CNN) processor with an InGaAs Focal Plane Array (FPA) using both bump bonding and epitaxial layer transfer techniques for use in the Ballistic Missile Defense System (BMDS) interceptor seekers. The goal is to fabricate a massively parallel digital processor with a local as well as a global interconnect architecture. Currently, this unique CNN processor is capable of processing a target scene in excess of 10,000 frames per second with its visible sensor. What makes the CNN processor so unique is that each processing element includes memory, local data storage, local and global communication devices and a visible sensor supported by a programmable analog or digital computer program.
AB - The intent of this investigation is to replace the low fill factor visible sensor of a Cellular Neural Network (CNN) processor with an InGaAs Focal Plane Array (FPA) using both bump bonding and epitaxial layer transfer techniques for use in the Ballistic Missile Defense System (BMDS) interceptor seekers. The goal is to fabricate a massively parallel digital processor with a local as well as a global interconnect architecture. Currently, this unique CNN processor is capable of processing a target scene in excess of 10,000 frames per second with its visible sensor. What makes the CNN processor so unique is that each processing element includes memory, local data storage, local and global communication devices and a visible sensor supported by a programmable analog or digital computer program.
UR - https://www.scopus.com/pages/publications/45549102380
UR - https://www.scopus.com/pages/publications/45549102380#tab=citedBy
U2 - 10.1117/12.777057
DO - 10.1117/12.777057
M3 - Conference contribution
AN - SCOPUS:45549102380
SN - 9780819471314
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Infrared Technology and Applications XXXIV
T2 - Infrared Technology and Applications XXXIV
Y2 - 17 March 2008 through 20 March 2008
ER -